VIA Announces Comprehensive Support for TPM Technology!

[Dashken]

Taipei, Taiwan, 30 March 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced cooperation with industry partners to ensure broad TPM support for VIA’s market-leading lineup of chipset solutions for the Intel®, AMD, and VIA processor platforms.

Trusted Platform Module (TPM) technology is an industry effort aimed at reducing some of the risks facing modern day computing. Addressing issues such as data theft, unauthorized PC access, and unauthorized network access, the TPM standard incorporates a number of capabilities that will be increasingly important as businesses and users give greater priority to safe computing. The TPM architecture comprises a discrete module connected through the chipset South Bridge, with associated BIOS support. As a premium chipset provider, VIA has been working with industry partners to ensure leading TPM support to meet growing customer requirements.

Working with leading industry partners, VIA has validated STMicroelectronics TPM modules together with VIA’s latest South Bridge solutions, and leading BIOS solutions from AMI and Insyde Software supporting TPM technology.

“Security is a growing concern for all PC users today, and with Trusted Platform Module technology the industry is working together to provide a fully packaged solution that addresses user concerns,” commented Chewei Lin, Vice President of Product Marketing, VIA Technologies, Inc. “As the second largest chipset provider in the world, VIA is proud to be working with leading industry partners to offer our joint customers advanced TPM support for next generation OS and user requirements.”

“STMicroelectronic’s TPM modules deliver the stability, manageability, and security that form an optimal solution for next generation security requirements,” commented Vincent Cousin, of STMicroelectronics Asia Pacific Digital Secure Access Business Unit, “As the first company to offer an integrated TCG 1.2 solution, STMicroelectonics’ cooperation with VIA ensures our customers a comprehensive solution for the latest desktop and laptop PCs.”

“Insyde’s MobilePRO™ BIOS and UEFI InsydeH2O™ are ideal solutions for system developers looking to integrate TPM support providing high flexibility and attention to market requirements,” commented Aven Chuang, Vice President of Marketing, Insyde Software. “In our partnership with VIA we can together offer full TPM support to meet expanding industry requirements.”

“With the latest AMIBIOS®8 technology, AMI together with VIA’s latest chipset solutions provide a solid platform for TPM support,” commented Charles Hanes, Sales Director, American Megatrends Inc. “AMIBIOS offers a flexible, advanced, modular system software that can easily incorporate the latest TPM modules to ensure easy integration by customers.”

Source: http://www.via.com.tw