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Old 18th Apr 2012, 01:32 AM   #1 (permalink)
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Default Kingston Technology unveils new package design for system-specific memory modules

Hsinchu, Taiwan – April 17, 2012 – Kingston Technology today revealed its all-new packaging for the system-specific memory modules for APPLE, DELL, HP, LENOVO, SONY, and TOSHIBA notebooks, aiming to build up a new connection with these branded notebooks. Available in APAC region only, the new packaging will be unique and made especially for the brands that Kingston shares a strong relationship with –APPLE, DELL, HP, LENOVO, SONY, and TOSHIBA. The revamped look is perfect to boost the unique special memory modules.

This is what Ann Bai –DRAM Sales Director, APAC region, Kingston, had to say about the stylish new packaging. “We’re excited to showcase the new packaging for our system-specific memory modules. The best thing about Kingston’s customised memory is that compatibility is never an issue – it is tailor made especially for your particular notebook. We’ve received excellent feedback from users and critics alike for these memory modules. We share an excellent relationship with all our brand partners and this is yet another step forward in sustaining that strong partnership.”

Listed below are the part numbers of the modules with unique, new packaging:

Capacity and Features
APPLE : KTA-MB1333/4GFR : 4GB, DDR3, 1333MHz 204-pin Unbuffered SODIMM, 1.5V
DELL : KTD-L3B/4GFR : 4GB, DDR3, 1333MHz 204-pin Unbuffered SODIMM, 1.5V
HP : KTH-X3B/4GFR : 4GB, DDR3, 1333MHz 204-pin Unbuffered SODIMM, 1.5V
LENOVO : KTL-TP3B/4GFR : 4GB, DDR3, 1333MHz 204-pin Unbuffered SODIMM, 1.5V
SONY : M51264J90FR : 4GB, DDR3, 1333MHz 204-pin Unbuffered SODIMM, 1.5V
TOSHIBA : KTT-S3B/4GFR : 4GB, DDR3, 1333MHz 204-pin Unbuffered SODIMM, 1.5V
*FR: Far East retail package

The newly packaged products, shipping immediately in APAC region, will be a great way to reinforce the influential position Kingston has in the memory market, especially since it works with the impressive brands mentioned above.
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