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Old 10th Aug 2008, 03:05 PM   #121 (permalink)
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Why is it desgined to be convex? Wouldn't better contact result in better heat transfer?
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Old 10th Aug 2008, 03:38 PM   #122 (permalink)
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I think its because the IHS is not perfectly flat (usually concave). I know a popular thing to do with waterblocks is to bow the surface with thicker washers.
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Old 10th Aug 2008, 03:55 PM   #123 (permalink)
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Well anyone lapping their heatsink will probably lap the IHS of their cpu too. The thing is, while the line down the middle is slightly concave, the TRUE is just too convex to make proper contact. This can be verified by removing the HS after mounting.
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Old 10th Aug 2008, 07:50 PM   #124 (permalink)
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Don't forget, metal will still flex under intense mounting pressure. A little more convex is better than concave surface without contact on the most important area, the center. That's why manufacturer has started making convex surfaces. Swiftech, Thermalright were very famous for excellent finishing. Why would they do that if it wasn't a good idea?
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Old 10th Aug 2008, 09:19 PM   #125 (permalink)
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Why convex? The answer is very simple: to increase the mounting pressure at the center of IHS. (which is the hottest spot on the processor)

Let's compare convex base vs flat base (let's just assume the IHS is flat or just slightly uneven).

By making the base convex, you are basically reducing the area of contact between the base and the IHS. Does this mean you will get worse temp? Nope, not really.

Because: Pressure = Force / Area

Assume the same amount of force is coming from the mounting mechanism for both convex base and flat base waterblock/heatsink. By reducing the area of contact, you are essentially increasing the amount of pressure applied on the IHS, which is concentrated at the center of the IHS. This effectively lowers the thermal resistance between the base/TIM/IHS. This is why a bowed Apogee GT outperforms a flat Apogee GT waterblock easily and by a significant margin, one of the many examples.
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Old 10th Aug 2008, 09:41 PM   #126 (permalink)
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Quote:
Originally Posted by Chai View Post
Don't forget, metal will still flex under intense mounting pressure. A little more convex is better than concave surface without contact on the most important area, the center. That's why manufacturer has started making convex surfaces. Swiftech, Thermalright were very famous for excellent finishing. Why would they do that if it wasn't a good idea?
If you actually applied THAT much mounting pressure to the point that it causes the copper base to flex, it won't return to it's original shape anymore because copper has quite low yield strength (not sure if this is the correct term). If that happens, you won't be able to use the waterblock anymore. I don't think it's going to happen on heatsink base because they are just too thick, no matter how hard you try.

The bases (particularly waterblocks) are usually thick enough and shouldn't flex if you just hand tighten the nuts + bolts, even if you try really hard.
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Old 11th Aug 2008, 01:04 AM   #127 (permalink)
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Thanks for the info guys. How does the thermalright IFX-14 compare to the ultra extreme?
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Old 11th Aug 2008, 08:46 PM   #128 (permalink)
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AFAIK, Ultra 120 Extreme is slightly better than IFX-14.
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Old 6th Sep 2008, 12:38 AM   #129 (permalink)
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So yeah.

I are teh slow.

3.8GHz on stock 1.2v (still finding stock voltage baseline).
CPU-Z Validator 2.1

8 hour prime stable (I also used IntelBurnTest as a quick acid test).

Still pushing (and loving it).
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Old 6th Sep 2008, 02:20 AM   #130 (permalink)
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4.2GHz (1.32v) and counting!

20 Passes IntelBurnTest (I will save a big prime95 for last).

CPU-Z Validator 2.1
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