VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90

Discussion in 'News' started by Adrian Wong, Feb 26, 2012.

  1. Adrian Wong

    Adrian Wong Da Boss

    Taipei, Taiwan, 24th February, 2012 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

    Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.

    Along with the VIA COMe-8X90 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.

    “Embedded modules are ideal for creating highly tailored solutions with a short time to market approach,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COMe-8X90 module provides customers with an easily customizable platform with power efficient processing and rich I/O options, allowing them to quickly create optimized products for their target markets.”

    The VIA COMe-8X90 module will be on display at the VIA Embedded booth in Hall 1 of the Embedded World 2012 Exhibition and Conference, which is being held in Nuremberg, Germany from February 28th to March 1st, 2012. In addition, VIA will be presenting the latest embedded Android and x86 multi-core solutions for next generation embedded applications.

    VIA COMe-8X90 Module
    Available in the industry standard COM Express form factor of 95mm x 125mm, the VIA COMe-8X90 module includes a 1.2GHz VIA Nano X2 E-Series dual core processor and a VIA VX900H MSP, which features the VIA ChromotionHD 2.0 video engine, boasting hardware acceleration of the most demanding video formats, including MPEG-4, H.264, MPEG-2, VC-1, WMV and Blu-ray support, for incredibly smooth playback of multimedia titles at resolutions up to 1080p. The VIA COMe-8X90 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS, VGA, Display Port and HDMI.

    Onboard I/O includes two SATA II ports, one GigaLAN port, one USB client port, four USB 2.0 ports, SDIO, expansion buses for one PCIe X4 and one PCIe x1 and the VIA Labs VL800 USB 3.0 host controller which offers support for four USB 3.0 ports. System memory support includes two slots for up to 8GB of SODIMM DDR3 RAM.

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